The global bonding sheet market consists of thin, transparent thermoplastic materials that are used for temporarily bonding or laminating of components in electronics manufacturing. Bonding sheets find wide applications in flip chip mounting of microscopic components, wafer-level packaging and encapsulation of 5G semiconductors. They offer benefits such as uniform heat distribution, accurate bonding control, protection against dust/contamination and increased productivity through automation.
The Global Bonding Sheet Market is estimated to be valued at US$ 446.07 Mn in 2024 and is expected to exhibit a CAGR of 7.5% over the forecast period 2024 to 2031.
Key Takeaways
Key players operating in the global bonding sheet market are Arisawa Manufacturing Co., Dexerials Corporation, DuPont, Fujikura Ltd., Hanwha Solutions Advanced Materials Division, Microcosm Technology Co., Ltd., Namics Corporation, Nikkan Industries Co.,Ltd, Nippon Mektron Ltd., Nitto Denko Corporation, Shin-Etsu Polymer Co., Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd., Toray Industries, Inc., Qinglong Adhesives, Orion Packart.
The Bonding Sheet Market Size for smartphones, wearables and other mobile devices is driving the need for miniaturization and integration of sophisticated electronic components. Bonding sheets help enable advanced wafer level packaging technologies essential for developing micro-sized 5G chips with high performance.
The market is witnessing increased globalization with major players expanding their manufacturing footprint and R&D centers across Asia Pacific, Europe and North America to cater to the growing local demand. Collaboration with semiconductor fabricators and OSAT companies is helping gain customer confidence.
Market Key Trends
One of the key trends in the global bonding sheet market is the growing popularity of temporary bonding with ultraviolet (UV) curable adhesives. UV curable bonding sheets offer benefits such as faster curing, higher throughput, flexibility in controlling bond strength and ease of debonding. They are increasingly being used for wafer/chip level advanced packaging involving 3D/TSMC stacking and fan-out panel level packaging (FOPLP). The higher reliability and precision offered by UV bonding sheets is expected to drive its adoption.
Porter's Analysis
Threat of new entrants: Bonding sheet market requires large capital investments in R&D and manufacturing facilities to produce high quality products. This poses significant entry barriers for new players.
Bargaining power of buyers: The global bonding sheet market has numerous buyers including consumer electronics, transportation, construction and other end-use industries.individual buyers have low bargaining power compared to existing players.
Bargaining power of suppliers: A few major players dominate the supply of raw materials like adhesives, polymers and additives used in bonding sheets. This gives them significant bargaining power over buyers.
Threat of new substitutes: There are limited product substitutes for bonding sheets in various industries. However, new adhesive technologies can pose a potential threat.
Competitive rivalry: The global bonding sheet market is moderately consolidated. Key players compete based on product quality, reliability, pricing and innovation.
Geographical Regions
Asia Pacific accounts for the largest share of the Bonding Sheet Market Regional, both in terms of production and consumption. China, Japan, South Korea and other Asian countries are major manufacturing hubs for electronics and automotive industries which heavily rely on bonding sheets.
North America is the fastest growing regional market for bonding sheets stimulated by rebounding construction, automotive and electronics manufacturing. Increasing research on advanced materials is helping expand bonding sheet applications in the region.
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